TL431
Package Mechanical Data
4
Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages.
These packages have a Lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com.
4.1
SO-8 Package
SO-8 MECHANICAL DATA
DIM.
A
A1
A2
B
C
D
E
e
H
h
L
k
ddd
0.1
5.80
0.25
0.40
mm.
MIN.
1.35
0.10
1.10
0.33
0.19
4.80
3.80
1.27
6.20
0.50
1.27
8˚ (max.)
0.04
0.228
0.010
0.016
TYP
MAX.
1.75
0.25
1.65
0.51
0.25
5.00
4.00
MIN.
0.053
0.04
0.043
0.013
0.007
0.189
0.150
0.050
0.244
0.020
0.050
inch
TYP.
MAX.
0.069
0.010
0.065
0.020
0.010
0.197
0.157
0016023/C
9/13
STMICROELECTRONICS [ STMICROELECTRONICS ]
